E Catalogue

90 www.nordsonefd.com info@nordsonefd.com USA & Canada 800-556-3484 Europe +44 (0) 1582 666334 Asia +86 (21) 3866 9006 Thermal Compounds TC70 thermal compounds are a product line of unique synthetic-based thermal greases with excellent thermal conductivity. They are used in industries such as electronics (computer, appliance, wireless, etc.), automotive, and electrical to ensure quick, efficient heat transfer and dissipation. The primary advantage of these non-silicone products is long-term material stability. TC70 compounds will not leach, dry, harden, or melt in normal industrial use. THERMAL COMPOUNDS Specifications Property TC70 TC70-340WC TC70-57000 Consistency 320 340 250-350 (Penetration, worked, 60x) Specific Gravity 2.7 2.7 N/A at 25°C Bleed 0.1 0 0.5 24 Hrs., %/Weight at 200°C at 150°C at 200°C Evaporation 0.6 1 1 24 Hrs., %/Weight at 200°C at 150°C at 200°C Thermal Conductivity 0.92 1.3 2.4 36°C W/m °K Electrical Properties Dielectric strength 305 265 N/A 0.05” gap, V/mil Dielectric constant 4.50 5.02 N/A 25°C, 1,000 Hz Dissipation factor 0.0029 0.0022 N/A 25°C, 1,000 Hz Volume Resistivity 1.65 x 10 14 20.0 x 10 14 < 0.01 Ohm-cm Operating -40°C -40°C -40°C Temperature Range to 200°C to 180°C to 200°C Appearance Smooth, Smooth, Smooth Off-White Paste White Paste Paste TC70 TC70-340WC PACKAGE APPLICATION 7028323 7028332 10cc barrel, 25 g For use with dispensers 7028324 7028333 10cc barrel, 25 g For manual application 7028325 7028334 30cc barrel, 75 g For use with dispensers 7028326 7028335 30cc barrel, 75 g For manual application 7028327 7028336 55cc barrel, 100 g For use with dispensers 7028328 7028337 6 oz cartridge, 400 g For dispense valves 7028329 7028338 jar, 1 lb / 450 g For manual application 7028330 7028339 pail, 80 lb / 36.3 kg For high volume applications TC70-57000 PACKAGE APPLICATION 7028341 10cc barrel, 50 g For use with dispensers 7028342 jar, 1 oz / 28 g For manual application 7028343 jar, 100 g For manual application 7028344 jar, 1 lb / 454 g For manual application Thermal Compound Choices TC70 The most widely used non-silicone thermal compound. Major applications include mounting power transistors, power resistors, diodes and other semiconductor devices, coupling heat generating assemblies to chassis, heat transfer medium on ballast, thermal joints, thermocouple wells, and for any device where efficient cooling is required. TC70-340WC Ideally suited for applications where a device may need to be removed from the heat sink at a later time and cleans up with only water. This non-silicone thermal compound has high thermal conductivity, excellent dielectric properties and will spread into a very thin bond line for extremely low thermal resistance. TC70-57000 A non-silicone thermal compound with premium electrical and thermal conductivity. Major applications include high power electronic components such as power resistors, rectifiers, transistors and transformers; low power electronic applications such as static drain, grounding, soft electronic connections, heat dissipation, and assembly protection as well as high power electrical applications to improve the operational efficiency of high power switches and other sliding metal contacts.