E Catalogue

89 SOLDER FORMULATIONS Flux Choices No Clean (NC) NC flux has low activity and is suited to easily solderable surfaces. NC residue is clear, hard, non-corrosive, non- conductive, and designed to be left on your assembly. Residue may be removed with an appropriate solvent. Rosin Mildly Activated (RMA) Most RMA flux is fairly low in activity and best suited to easily solderable surfaces. RMA flux residue is clear, soft, non-corrosive, and non-conductive. Cleaning is optional. Residue may be removed with an appropriate solvent. Rosin Activated (RA) RA flux has higher activity than RMA for moderately oxidized surfaces. RA flux residue is corrosive and should be removed as soon as possible after reflow to prevent damage to your assembly. Water Soluble (WS) WS flux comes in a wide range of activity levels for soldering to even the most difficult surfaces. WS flux residue is corrosive and should be removed as soon as possible after reflow to avoid damage to your assembly. www.nordsonefd.com info@nordsonefd.com USA & Canada 800-556-3484 Europe +44 (0) 1582 666334 Asia +86 (21) 3866 9006 Solder Formulations There are many possible options when formulating a solder paste. EFD’s general purpose solder pastes will meet the requirements of most applications. For special requirements, EFD offers a wide range of specialized formulations. To find out which solder paste is the best solution for your application, please contact your Nordson EFD solder sales specialist for a free consultation. Paste Features Halide-Free We offer a range of halide-free solder pastes that meet environmental trends and regulations. Halides such as Chloride, Bromide, Fluoride or Iodide are used in some flux activators to assist in oxide removal. Rapid Reflow Our rapid reflow solder pastes will not spatter when heated and melted as quickly as 0.25 seconds by solder iron, induction, laser, hot bar or other rapid reflow devices. Pin Transfer or Dipping Solder paste that is applied by dipping a component or pin into the paste. For applications that do not lend themselves to printing or dispensing, such as pin arrays or manufacture of LED’s. Low Residue The quantity of flux residue left after reflow is less than with normal solder pastes. Either there is less flux to begin with, or a larger percentage evaporates as part of the reflow process. Difficult-to-Solder Surfaces Solder paste for difficult-to-wet metals metals such as Alloy42 lead finishes and highly oxidized surfaces of aged components and boards. Gap Filling and/or Vertical Surfaces The flux is designed to hold the alloy in place until liquidus is reached. These formulas are suited to bridging gaps, filling holes and soldering joints on vertical surfaces. ALLOY CHART Alloy: Solidus (°C) Liquidus (°C) Tensile Strength (psi) Sn43 Pb43 Bi14 144 163 6120 Sn62 Pb36 Ag2 179 189 6700 Sn63 Pb37 183 6700 Sn60 Pb40 183 191 6200 Sn10 Pb88 Ag2 268 290 4900 Sn10 Pb90 275 302 4600 Sn5 Pb92.5 Ag2.5 287 296 4210 Sn5 Pb95 308 312 4190 POWDER SIZE CHART Powder Type Powder Size (micron) Gullwing Lead Pitch (mm) Square/Circle Aperture (mm)/(in) Dispense Dot Dia. (mm)/(in) II 45-75 0.65 / 0.025 0.65 / 0.025 0.80 / 0.030 III 25-45 0.50 / 0.020 0.50 / 0.020 0.50 / 0.020 IV 20-38 0.30 / 0.012 0.30 / 0.012 0.30 / 0.012 V 15-25 0.20 / 0.008 0.15 / 0.006 0.25 / 0.010 VI 5-15 0.10 / 0.004 0.05 / 0.002 0.10 / 0.004 LEAD-FREE ALLOY CHART Alloy: Solidus (°C) Liquidus (°C) Tensile Strength (psi) Sn42 Bi57 Ag1.0 137 139 4641 Sn42 Bi58 138 8000 Sn96.5 Ag3.0 Cu0.5 217 219 8900 Sn96.3 Ag3.7 221 8900 Sn95 Ag5 221 245 10100 Sn100 MP 232 1800 Sn99.3 Cu0.7 227 n/a Sn95 Sb5 232 240 5900 Sn89 Sb10.5 Cu0.5 242 262 12000 Sn90 Sb10 250 257 n/a